Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Features:
- Suitable for CPU, chipsets on Mainboard, VGA card, etc.
- Easy to use.
- Zif Socket Templates ensure correct applying area with various CPU socket types.
- Produces an even layer when using applicator.
- Dielectric.
- Wide range of application temperature.
Specifications:
Form
1 Part
Color
White
Viscosity/Flowability
Nonflowing
Specific Gravity (cured)
2.37
Shelf Life
24 months from DOM
Dielectric Constant
4.4 at 100k Hz
Volume Resistivity
5.0 x 1015
Dissipation Factor
0.02 at 100k Hz
Dielectric Strength
550 volts/mil; 21.7 kV/mm
Thermal Conductivity
0.8 watts/meter- °C
Question & Answer
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