Intel STS100C Thermal Solution with Fan, compatible with Intel Socket LGA: 1366.
Product Features
Passive/active combination heat sink with removable fan.
Features:
• Recommended usage:
• With fan installed: Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink
• With fan removed:
• Pedestal chassis with ducted airflow to heat sink
• 2U or larger rack chassis2 with ducted airflow to heat sink
• Maximum CPU TDP: 130W
• Boxed product code: BXSTS100C
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